kb8tq@n1k.org said:
[context is EFC control voltage]
Generally, the biggest factor is the voltage drop from the oven current
getting into the EFC “loop”. Its actually pretty hard to keep them separate.
Is there a fundamental problem, or is it just that everybody uses historical
footprints that don't have separate ground pins?
--
These are my opinions. I hate spam.
Am 21.03.2018 um 23:03 schrieb Hal Murray:
kb8tq@n1k.org said:
[context is EFC control voltage]
Generally, the biggest factor is the voltage drop from the oven current
getting into the EFC “loop”. Its actually pretty hard to keep them separate.
Is there a fundamental problem, or is it just that everybody uses historical
footprints that don't have separate ground pins?
The HP 10811 has separate pins for oscillator and oven, for
power and gnd, and 2 of them for each of the four.
regards, Gerhard
Hi
The gotcha is not on the manufacturing end. When you show up with a dual ground
pin part, the OEM asks: Where do I tell the PCB layout guys to put the other ground?
The answer always comes back to “there’s only one ground plane, they will both connect
to the same plane.”. If you get past that, the somewhat surprising next layer is that
temperature performance maybe isn’t that big a deal to them ….
Bob
On Mar 21, 2018, at 6:03 PM, Hal Murray hmurray@megapathdsl.net wrote:
kb8tq@n1k.org said:
[context is EFC control voltage]
Generally, the biggest factor is the voltage drop from the oven current
getting into the EFC “loop”. Its actually pretty hard to keep them separate.
Is there a fundamental problem, or is it just that everybody uses historical
footprints that don't have separate ground pins?
--
These are my opinions. I hate spam.
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