If not Nitrogen, how about dry ice (-109F -78C)?
Dry ice is relatively easy to get. It wouldn't be hard to try a quick
experiment.
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On 4/2/18 1:39 PM, Hal Murray wrote:
If not Nitrogen, how about dry ice (-109F -78C)?
Dry ice is relatively easy to get. It wouldn't be hard to try a quick
experiment.
CTE mismatch in packages will be a significant problem - you might find
that your ICs don't work because bond wires have been ripped off the
die. Parts might have popped off the board too.
But if you have one, and it's sacrificable, give it a try - a cooler
with some dry ice, and put the circuit above the dry ice, and it will
cool slowly
Hi
On Apr 2, 2018, at 11:18 PM, jimlux jimlux@earthlink.net wrote:
On 4/2/18 1:39 PM, Hal Murray wrote:
If not Nitrogen, how about dry ice (-109F -78C)?
Dry ice is relatively easy to get. It wouldn't be hard to try a quick
experiment.
CTE mismatch in packages will be a significant problem - you might find that your ICs don't work because bond wires have been ripped off the die. Parts might have popped off the board too.
But if you have one, and it's sacrificable, give it a try - a cooler with some dry ice, and put the circuit above the dry ice, and it will cool slowly
The first level solution is to forget about things like die coat and (gulp) die attach epoxy …. yes, this makes building things a bit insane.
Bob
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